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INTEGRATED CIRCUITS
DATA SHEET
TDA9851 I2C-bus controlled economic BTSC stereo decoder
Product specification File under Integrated Circuits, IC02 1997 Nov 12
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
FEATURES * Voltage Controlled Amplifier (VCA) noise reduction circuit * Stereo or mono selectable at the AF outputs * Stereo pilot PLL circuit with ceramic resonator * Automatic pilot cancellation * Automatic Volume Level (AVL) control (+6 to -15 dB) * I2C-bus transceiver. GENERAL DESCRIPTION The TDA9851 is a bipolar-integrated BTSC stereo decoder for application in TV sets, VCRs and multimedia PCs. QUICK REFERENCE DATA SYMBOL VCC ICC Vo(rms) PARAMETER supply voltage supply current output voltage (RMS value) composite input voltage 250 mV (RMS) for 100% modulation L + R (25 kHz deviation); fmod = 300 Hz 14% modulation; fL = 300 Hz; fR = 3 kHz 100% modulation L or R; fmod = 1 kHz mono mode; referenced to 500 mV output signal CCIR 468-2 weighted; quasi peak DIN noise weighting filter (RMS value) ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA9851 TDA9851T SDIP24 SO24 DESCRIPTION plastic shrink dual in-line package; 24 leads (400 mil) plastic small outline package; 24 leads; body width 7.5 mm 50 - 60 73 CONDITIONS MIN. 8 - - TYP. 9 30 500
TDA9851
MAX. 9.5 40 -
UNIT V mA mV
csL,R THDL,R S/N
stereo channel separation L and R total harmonic distortion L and R signal-to-noise ratio
- -
20 0.2
- 1.0
dB %
- -
dB dBA
VERSION SOT234-1 SOT137-1
1997 Nov 12
2
book, full pagewidth
1997 Nov 12
C3 C4 C6 n.c. CP2 CER 4 8 12 13 9 11 16 6 3 CPH CMO CAV CSS R1 Q1 C5 C7 L+R DEMATRIX AND MODE SELECT AUTOMATIC VOLUME LEVEL OUTL OUTR L-R
BLOCK DIAGRAM
Philips Semiconductors
C2
CP1
5
composite baseband input
COMP
7
STEREO DECODER
C1
FDI
21
TDA9851
24 SUPPLY I2C-BUS TRANSCEIVER
I2C-bus controlled economic BTSC stereo decoder
3
FILTER AND REFERENCE 18 CW C11 VCC C13 C14 C15 TW VCAP AGND Vref 17 2 15 22 14 10 RFR R4
R2
SDA 1
FDO 20
DETECTOR AND VOLTAGE CONTROLLED AMPLIFIER
SCL
R3 23 DGND
19
C9
BPU
C10
MHA969
Product specification
TDA9851
Fig.1 Block diagram.
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
TDA9851
Component list Electrolytic capacitors 20%; foil capacitors 10%; resistors 5%; unless otherwise specified; see Fig.1. COMPONENT C1 C2 C3 C4 C5 C6 C7 C9 C10 C11 C13 C14 C15 R1 R2 R3 R4 Q1 VALUE 2.2 F 220 nF 2.2 F 220 nF 2.2 F 2.2 F 4.7 F 22 nF 4.7 nF 1 F 10 F 100 F 100 F 3.3 k 15 k 1.3 k 100 k CSB503F58 CSB503JF958 radial leads alternative as SMD foil electrolytic foil electrolytic electrolytic electrolytic foil foil electrolytic electrolytic electrolytic electrolytic 63 V 63 V 16 V 16 V 63 V 63 V 63 V 10% 63 V TYPE electrolytic 63 V REMARK
1997 Nov 12
4
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
PINNING SYMBOL PIN SCL VCC CPH CER CP1 CP2 COMP CMO CSS RFR n.c. OUTL OUTR Vref VCAP CAV TW CW BPU FDO FDI AGND DGND SDA 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION serial clock input (I2C-bus) supply voltage capacitor for phase detector ceramic resonator capacitor for pilot detector capacitor for pilot detector composite input signal capacitor DC-decoupling mono capacitor DC-decoupling stereo resistor for filter reference not connected output, left channel output, right channel reference voltage 0.5VCC capacitor for electronic filtering of supply automatic volume control capacitor capacitor timing capacitor for VCA and band-pass filter lower corner frequency band-pass filter upper corner frequency fixed de-emphasis output fixed de-emphasis input analog ground digital ground serial data input/output (I2C-bus) Fig.2 Pin configuration.
handbook, halfpage
TDA9851
SCL 1 VCC 2 CPH 3 CER 4 CP1 5 CP2 6
24 SDA 23 DGND 22 AGND 21 FDI 20 FDO 19 BPU
TDA9851
COMP 7 CMO 8 CSS 9 RFR 10 n.c. 11 OUTL 12
MHA968
18 CW 17 TW 16 CAV 15 VCAP 14 Vref 13 OUTR
1997 Nov 12
5
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
FUNCTIONAL DESCRIPTION Stereo decoder The composite signal is fed into a pilot detector/pilot cancellation circuit and into the MPX demodulator. The main L + R signal passes a 75 s fixed de-emphasis filter and is fed into the dematrix circuit. The decoded sub-signal L - R is sent to the VCA circuit. To generate the pilot signal the stereo demodulator uses a PLL circuit including a ceramic resonator. Mode selection The L - R signal is fed via the internal VCA circuit to the dematrix/switching circuit. Mode selection is achieved via the I2C-bus. Automatic volume level control The automatic volume level stage controls its output voltage to a constant level of typically 200 mV (RMS) from LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC VSDA, VSCL Vn Tamb Tstg Ves Note 1. Machine model class B. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient TDA9851 (SOT234-1; SDIP24) TDA9851T (SOT137-1; SO24) CONDITIONS in free air 55 90 VALUE supply voltage voltage of SDA and SCL to GND voltage of all other pins to GND operating ambient temperature storage temperature electrostatic handling note 1 Tj < 125 C VCC < 9 V VCC 9 V PARAMETER CONDITIONS 0 0 0 0 -20 -65 - MIN.
TDA9851
an input voltage range between 0.1 to 1.1 V (RMS). The circuit adjusts variations in modulation during broadcasting and because of changes in the programme material. The function can be switched off. To avoid audible plops during the permanent operation of the AVL circuit a soft blending scheme has been applied between the different gain stages. A capacitor (4.7 F) at pin CAV determines the attack and decay time constants. In addition the ratio of attack and decay times can be changed via the I2C-bus. Integrated filters The filter functions necessary for stereo demodulation are provided on-chip using transconductor circuits. The filter frequencies are controlled by the filter reference circuit via the external resistor R4.
MAX. 9.9 VCC 9 VCC +70 +150 - V V V V
UNIT
C C V
UNIT K/W K/W
1997 Nov 12
6
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
TDA9851
CHARACTERISTICS All voltages are measured relative to GND; VCC = 9 V; Rs = 600 ; AC-coupled; RL = 10 k; CL = 2.5 nF; fmod = 1 kHz mono signal; composite input voltage 250 mV (RMS) for 100% modulation L + R (25 kHz deviation); Tamb = 25 C; see Fig.1; unless otherwise specified. SYMBOL Supply VCC ICC Input stage Vi(max)(rms) Zi HR Vpil(rms) Vth(on)(rms) Vth(off)(rms) hys Vo(rms) csL,R THDL,R S/N maximum input voltage (RMS value) input impedance 2 20 - 25 - 50 - - 2.5 500 20 0.2 - 30 - - 35 - - - - 1.0 V k supply voltage supply current 8 - 9 30 9.5 40 V mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Stereo decoder headroom for L + R, L and R nominal stereo pilot voltage (RMS value) pilot threshold voltage stereo on (RMS value) pilot threshold voltage stereo off (RMS value) hysteresis output voltage (RMS value) stereo channel separation L and R total harmonic distortion L and R signal-to-noise ratio 100% modulation L + R; fmod = 300 Hz 14% modulation; fL = 300 Hz; fR = 3 kHz 100% modulation L or R; fmod = 1 kHz mono mode; referenced to 500 mV output signal CCIR 468-2 weighted; quasi peak DIN noise weighting filter (RMS value) Stereo decoder, oscillator (VCXO); note 1 fo ffr fcr nominal VCXO output frequency (32fH) spread of free-running frequency capture range frequency with nominal ceramic resonator with nominal ceramic resonator nominal pilot - 500.0 190 503.5 - 265 - 507.0 - kHz kHz Hz 50 - 60 73 - - dB dBA fmod = 300 Hz; THD < 15% 9 - - 15 - - - - dB mV mV mV dB mV dB %
1997 Nov 12
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Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
SYMBOL PARAMETER CONDITIONS - 5 - 100% modulation; fmod = 1 kHz; SAP; mode selector switched to stereo 50 MIN. TYP.
TDA9851
MAX.
UNIT k nF dB
Outputs OUTL and OUTR Zo VO RL CL ct output impedance DC output voltage output load resistance (AC-coupled) output load capacitance crosstalk SAP into L and R 80 - - 70 120 - 2.5 - 0.45VCC 0.5VCC 0.55VCC V
VCA Is nominal timing current for nominal release rate of VCA detector nominal detector release rate Is can be measured at pin TW via current meter connected to 0.5VCC + 1 V nominal timing current and external capacitor values 6.5 8 9.5 A
Relrate
-
125
-
dB/s
Automatic volume level control Gv Gstep voltage gain equivalent step width between the input stages (soft switching system) input voltage (RMS value) output voltage in AVL operation (RMS value) DC offset voltage between different gain steps voltage at pin CAV 7.0 to 6.83 V or 6.83 to 6.61 V or 6.61 to 5.83 V or 5.83 to 3.1 V; note 3 AT1 = 0; AT2 = 0; note 4 AT1 = 1; AT2 = 0; note 4 AT1 = 0; AT2 = 1; note 4 AT1 = 1; AT2 = 1; note 4 Idec charge current for decay time power-on speed-up; CCD = 1; note 5 Muting at power supply voltage drop for OUTR and OUTL VCC supply voltage drop for mute active - VCAP - 0.7 - V maximum boost; note 2 maximum attenuation; note 2 Vo(rms) Voffset(DC) maximum boost; note 2 maximum attenuation; note 2 5 14 - 6 15 1.5 7 16 - dB dB dB
Viop(rms)
- - 160 -
0.1 1.125 200 -
- - 250 20
V V mV mV
Ratt
discharge resistors for attack time constant
340 590 0.96 1.7 -
420 730 1.2 2.1 2.0 30
520 910 1.5 2.6 2.4 -
k k A A
normal mode; CCD = 0; note 5 1.6
1997 Nov 12
8
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
SYMBOL PARAMETER CONDITIONS - 4.2 5.2 MIN. - 5 6 - - - - - TYP.
TDA9851
MAX.
UNIT
Power-on reset; note 6 VPOR(start) VPOR(end) start of reset voltage end of reset voltage increasing supply voltage decreasing supply voltage increasing supply voltage Digital part (I2C-bus pins); note 7 VIH VIL IIH IIL VOL HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current LOW-level output voltage IIL = 3 mA 3 -0.3 -10 -10 - VCC 9 +1.5 +10 +10 0.4 V V A A V 2.5 5.8 6.8 V V V
Notes to the characteristics 1. The oscillator is designed to operate together with Murata resonator CSB503F58 or CSB503JF958 as SMD. Change of the resonator supplier is possible, but the resonator specification must be close to the specified ones. 2. The AVL input voltage is internal. It corresponds to the output voltage OUTL and OUTR at AVL off. 3. The listed pin voltage corresponds with typical gain steps of +6 dB, +3 dB, 0 dB, -6 dB and -15 dB. 4. Attack time constant = CCAV x Ratt.
-G2 -G1 -------- ---------20 20 - 10 C CAV x 0.76 V 10 Decay time = --------------------------------------------------------------------------------I dec
5.
Example: CCAV = 4.7 F; Idec = 2 A; G1 = -9 dB; G2 = +6 dB decay time results in 4.14 s. 6. When reset is active the GMU bit (mute) is set and the I2C-bus receiver is in the reset position. 7. The AC characteristics are in accordance with the I2C-bus specification for standard mode (clock frequency maximum 100 kHz). A higher frequency, up to 280 kHz, can be used if all clock and data times are interpolated between standard mode (100 kHz) and fast mode (400 kHz) in accordance with the I2C-bus specification. Information about the I2C-bus can be found in brochure "I2C-bus and how to use it" (order number 9398 393 40011).
1997 Nov 12
9
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
I2C-BUS PROTOCOL I2C-bus format to read (slave transmits data) S Table 1 SLAVE ADDRESS R/W A DATA
TDA9851
P
Explanation of I2C-bus format to read (slave transmits data) NAME DESCRIPTION START condition; generated by the master 101 101 1 logic 1 (read); generated by the master acknowledge; generated by the slave slave transmits an 8-bit data word STOP condition; generated by the master Definition of the transmitted bytes after read condition LSB D6 Y D5 Y D4 Y D3 Y D2 Y D1 Y D0 STP
S Standard SLAVE ADDRESS (MAD) R/W A DATA P Table 2
MSB D7 Y Table 3
Function of the bits in Table 2 BITS FUNCTION stereo pilot identification (stereo received = 1) indefinite
STP Y
I2C-bus format to write (slave receives data) S Table 4 SLAVE ADDRESS R/W A DATA A P
Explanation of I2C-bus format to write (slave receives data) NAME DESCRIPTION START condition 101 101 1 logic 0 (write) acknowledge; generated by the slave see Table 5 STOP condition Definition of the DATA (second byte after MAD) LSB D6 0 D5 AT2 D4 AT1 D3 CCD D2 AVLON D1 GMU D0 STEREO
S Standard SLAVE ADDRESS (MAD) R/W A DATA P Table 5
MSB D7 0
1997 Nov 12
10
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
Table 6 Function of the bits in Table 5 FUNCTION mode selection stereo or mono mute control OUTL and OUTR AVL on/off increased AVL decay current on/off attack time at AVL Table 10 CCD bit setting FUNCTION Load current for normal AVL decay time Table 7 Mode setting READABLE BIT SETTING BIT STP STEREO 1 (stereo received) 1 (stereo received) 0 (no stereo received) 0 (no stereo received) 1 0 1 0 Increased load current Table 11 AVL attack time Ratt () 420 730 1200 2100 FUNCTION MODE OUTL Left Mono Mono Mono OUTR right mono mono mono Table 9 AVLON bit setting FUNCTION Automatic volume control on Automatic volume control off
TDA9851
BITS STEREO GMU AVLON CCD AT1 and AT2
DATA 1 0
DATA 0 1
DATA AT1 0 1 0 1 AT2 0 0 1 1
Table 8
Mute setting FUNCTION DATA GMU 1 0
Forced mute at OUTR and OUTL No forced mute at OUTR and OUTL
1997 Nov 12
11
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
INTERNAL PIN CONFIGURATIONS
TDA9851
1 1.8 k
2
+
MHA971
MHA972
Fig.3 Pin 1; SCL.
Fig.4 Pin 2; VCC.
3
+ +
4
3 k
MHA974
10 k
10 k
MHA973
Fig.5 Pin 3; CPH.
Fig.6 Pin 4; CER.
+
5
6
+
3.5 k
MHA975
8.5 k
12 k
MHA976
Fig.7 Pin 5; CP1. 1997 Nov 12 12
Fig.8 Pin 6; CP2.
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
TDA9851
7
+
25 k 25 k
8, 9
+
10 k 10 k
MHA978
50 pF 25 k 100 pF
MHA977
Fig.9 Pin 7; COMP.
Fig.10 Pin 8; CMO and pin 9; CSS.
+
12, 13
80
1 k
+
10
MHA979
MHA980
Fig.11 Pin 10; RFR.
Fig.12 Pin 12; OUTL and pin 13; OUTR.
14
+
15
3.4 k 4.7 k 3.4 k 300
5 k
MHA982 MHA981
Fig.13 Pin 14; Vref. 1997 Nov 12 13
Fig.14 Pin 15; VCAP.
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
TDA9851
16
17
+
+
MHA983
MHA984
Fig.15 Pin 16; CAV.
Fig.16 Pin 17; TW.
+
18
21
+
+
6 k 16 k 19
MHA985 MHA986
Fig.17 Pin 18; CW.
Fig.18 Pin 19; BPU and pin 21; FDI.
24 20 1.8 k
+
MHA987 MHA988
Fig.19 Pin 20; FDO.
Fig.20 Pin 24; SDA.
1997 Nov 12
14
1997 Nov 12
C9 R3 R2 DGND 23 22 21 20 19 18 17 16 15 14 13 AGND FDI FDO BPU CW TW OUTR CAV VCAP Vref C10 C11 C13 C7 C14 C15
Philips Semiconductors
APPLICATION INFORMATION
handbook, full pagewidth
SDA
SDA
24
TDA9851
2 CPH C4 Q1 VCC R1 composite baseband input C3 C5 C6 C2 C1 CER CP1 CP2 COMP CMO CSS RFR 3 4 5 6 7 8 9 10 11 n.c. 12 OUTL
I2C-bus controlled economic BTSC stereo decoder
15
R4
MHA970
1
SCL
SCL
Product specification
TDA9851
Fig.21 Application circuit.
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
PACKAGE OUTLINES SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)
TDA9851
SOT234-1
D seating plane
ME
A2
A
L
A1 c Z e b 24 13 b1 wM (e 1) MH
pin 1 index E
1
12
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT234-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A max. 4.7 A1 min. 0.51 A2 max. 3.8 b 1.3 0.8 b1 0.53 0.40 c 0.32 0.23 D (1) 22.3 21.4 E (1) 9.1 8.7 e 1.778 e1 10.16 L 3.2 2.8 ME 10.7 10.2 MH 12.2 10.5 w 0.18 Z (1) max. 1.6
ISSUE DATE 92-11-17 95-02-04
1997 Nov 12
16
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
TDA9851
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1997 Nov 12
17
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). SDIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA9851
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1997 Nov 12
18
Philips Semiconductors
Product specification
I2C-bus controlled economic BTSC stereo decoder
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA9851
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1997 Nov 12
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547047/1200/01/pp20
Date of release: 1997 Nov 12
Document order number:
9397 750 02702

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